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Stock: In Stock
Stock: In Stock
- Capacity: 141GB
- Type: HBM3e
- Bandwidth: 4.8 TB/s
- Power Consumption: Up to 700W
- Interface: PCIe 5.0 x16
Stock: In Stock
Stock: In Stock
- Capacity: 141GB
- Type: HBM3e
- Bandwidth: 4.8 TB/s
- Power Consumption: Up to 700W
- Interface: PCIe 5.0 x16
Stock: In Stock
Stock: In Stock
- CPU: Dual 5th/4th Gen Intel Xeon Scalable Processors
- GPU Type: NVIDIA HGX H200
- GPU Count: 8 GPUs
- GPU Memory: 141GB HBM3e Per GPU
- Tensor Cores: 4th Generation Tensor Cores
Stock: In Stock
Stock: In Stock
- GPU: NVIDIA HGX™ H100 / H200 8-GPU Platform
- Processor: Dual AMD EPYC™ 9005/9004 Series
- Memory: 24 x DDR5 RDIMM Slots
- Storage: 8 x 2.5" Gen5 NVMe/SATA/SAS-4 Bays
- Network: 2 x 10Gb/s LAN
- Power Supply: 3000W 80 PLUS Titanium Redundant
Stock: In Stock
Stock: In Stock
- GPU: 8 × NVIDIA H200 Tensor Core GPUs
- GPU Memory: 1,128GB HBM3e Total Memory
- CPU: Dual Intel Xeon Platinum 8480C Processors
- System Memory: 2TB DDR5
- Storage: 30TB NVMe SSD
Stock: In Stock
Stock: In Stock
- Designed for NVIDIA H100, H200 & A100 GPUs
- Efficient direct-to-chip liquid cooling technology
- High thermal conductivity of 205 W/m·K
- Compact dimensions for easy installation
- Robust aluminum construction for durability
- Supports maximum heat load of 5.5 kW
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Efficient liquid-to-chip heat transfer
- Compact dimensions of 180 × 100 × 15 mm
- Designed for maximum heat load of 1,000 W
- Microchannel fin type for enhanced cooling performance
- Durable copper construction for longevity
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