Product Compare0
AI Server Thermal Management
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Designed for NVIDIA H100 GPUs
- Efficient liquid-to-chip heat transfer
- Microchannel fin design for optimal cooling
- Lightweight at 1,078 g
- Supports maximum heat load of 8 kW
Stock: In Stock
Stock: In Stock
- Designed for NVIDIA H100, H200 & A100 GPUs
- Efficient direct-to-chip liquid cooling technology
- High thermal conductivity of 205 W/m·K
- Compact dimensions for easy installation
- Robust aluminum construction for durability
- Supports maximum heat load of 5.5 kW
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 1.5 W/m·K
- Customizable dimensions for various applications
- Non-conductive electrical properties
- Durable with a shelf life of 24 months
- Adhesive strength of 1.5 N/cm for reliable bonding
- Available in a versatile gray color
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 1.5 W/m·K
- Customizable dimensions for versatile applications
- Non-conductive electrical properties
- Durable with a shelf life of 24 months
- Available in a gray color for easy integration
- Adhesive strength of 1.5 N/cm for reliable bonding
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 1.5 W/m·K
- Customizable dimensions for various applications
- Non-conductive electrical properties
- Durable with a shelf life of 24 months
- Rectangular shape for easy integration
- Adhesive strength of 1.5 N/cm for reliable bonding
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 1.5 W/m·K
- Customizable dimensions for versatile applications
- Non-conductive electrical properties for safety
- Durable with a shelf life of 24 months
- Adhesive strength of 1.5 N/cm for reliable bonding
- Available in a practical gray color
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 1.5 W/m·K
- Customizable dimensions for versatile applications
- Non-conductive electrical properties for safety
- Durable with a shelf life of 24 months
- Available in a flexible thickness range of 0.5–5.0 mm
- Excellent adhesive strength of 1.0 N/cm
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 1.5 W/m·K
- Customizable dimensions for various applications
- Non-conductive electrical properties
- Durable with a shelf life of 24 months
- Rectangular shape for easy integration
- Thickness options from 0.5 to 5.0 mm
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 1.0 W/m·K
- Non-conductive electrical properties for safe use
- Durable adhesive strength of 15 N/cm
- Compact roll size of 125 mm x 10 m
- Long shelf life of 24 months
- Ideal for thermal management applications
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 0.60 W/m·K
- Non-conductive electrical properties
- Durable adhesive strength of 15 N/cm
- Ideal for thermal management applications
- Long shelf life of 24 months
- Compact roll dimensions of 25 mm x 10 m
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 0.60 W/m·K
- Non-conductive electrical properties
- Durable adhesive strength of 15 N/cm
- Ideal for thermal management applications
- Long shelf life of 24 months
- Easy-to-use roll format
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 0.60 W/m·K
- Non-conductive electrical properties
- Durable adhesive strength of 15 N/cm
- Easy application with roll format
- Long shelf life of 24 months
- Ideal for thermal management applications
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Efficient liquid-to-chip heat transfer
- Designed for maximum heat load of 700 W
- Compact dimensions of 180 × 100 × 15 mm
- Microchannel fin design for enhanced cooling
- Durable copper construction for longevity
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Direct-to-chip cooling technology for efficient heat transfer
- Compact dimensions of 300 × 120 × 18 mm
- Microchannel fin design for optimal cooling performance
- Lightweight at only 1,200 g
- Compatible with various GPU setups
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Efficient liquid-to-chip heat transfer
- Compact dimensions of 180 × 100 × 15 mm
- Designed for maximum heat load of 1,000 W
- Microchannel fin type for enhanced cooling performance
- Durable copper construction for longevity
Stock: In Stock
Stock: In Stock
- High airflow of 38.00 CFM for effective cooling
- Rated speed of 32,500 RPM for optimal performance
- PWM control for adjustable speed settings
- Long lifespan of 70,000 hours at 40°C
- Compact size of 40 × 40 mm for versatile installation
- Ideal for server cooling and high-density electronics
Stock: In Stock
Stock: In Stock
- High airflow of 33.90 CFM for efficient cooling
- Rated speed up to 29,500 RPM for superior performance
- Durable ball bearing design for extended lifespan
- PWM control for adjustable speed settings
- Compact size of 40 x 40 mm fits in tight spaces
- Ideal for server and high-density electronics cooling
Stock: In Stock
Stock: In Stock
- High airflow of 77.31 CFM for efficient cooling
- Rated speed of 25,500 RPM ensures optimal performance
- Durable ball bearing design for longevity
- PWM control for adjustable speed settings
- Compact size of 60 x 60 mm fits various applications
- Ideal for server and high-density electronics cooling
Stock: In Stock
Stock: In Stock
- High airflow rate of 76.51 CFM
- Rated speed of 24,300 RPM for efficient cooling
- Durable ball bearing design for longevity
- PWM control for adjustable speed
- Compact size of 60 x 60 mm
- Ideal for server and high-density electronics
Stock: In Stock
Stock: In Stock
- High airflow rate of 136 CFM for efficient cooling
- Rated speed of 16,300 RPM for optimal performance
- Durable ball bearing design for longevity
- PWM control for adjustable speed settings
- Lightweight design at 286 g for easy installation
- Ideal for server and high-density electronics cooling