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Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Designed for NVIDIA H100 GPUs
- Efficient liquid-to-chip heat transfer
- Microchannel fin design for optimal cooling
- Lightweight at 1,078 g
- Supports maximum heat load of 8 kW
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Efficient liquid-to-chip heat transfer
- Designed for maximum heat load of 700 W
- Compact dimensions of 180 × 100 × 15 mm
- Microchannel fin design for enhanced cooling
- Durable copper construction for longevity
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Efficient liquid-to-chip heat transfer
- Compact dimensions of 180 × 100 × 15 mm
- Designed for maximum heat load of 1,000 W
- Microchannel fin type for enhanced cooling performance
- Durable copper construction for longevity
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