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- High thermal conductivity of 385 W/m·K
- Designed for NVIDIA H100 GPUs
- Efficient liquid-to-chip heat transfer
- Microchannel fin design for optimal cooling
- Lightweight at 1,078 g
- Supports maximum heat load of 8 kW
Stock: In Stock
Stock: In Stock
- Designed for NVIDIA H100, H200 & A100 GPUs
- Efficient direct-to-chip liquid cooling technology
- High thermal conductivity of 205 W/m·K
- Compact dimensions for easy installation
- Robust aluminum construction for durability
- Supports maximum heat load of 5.5 kW
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