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Products meeting the search criteria
Stock: In Stock
Stock: In Stock
- CPU: Dual AMD EPYC 9005/9004 Series Processors
- GPU Type: PCIe Gen5 GPU Support
- GPU Count: Up to 4 GPUs
- GPU Memory: Depends on Installed GPU
- Tensor Cores: Depends on Installed GPU
- RT Cores: Depends on Installed GPU
Stock: In Stock
Stock: In Stock
- High-efficiency cooling for data centers
- Variable-capacity technology for energy savings
- Supports remote monitoring for ease of use
- Compact design fits in tight spaces
- Automatic fan speed regulation for optimal performance
- Designed for high-density server environments
-250x250.png "CoolIT CHx2000 2MW Liquid-to-Liquid Coolant Distribution Unit")
Stock: In Stock
Stock: In Stock
- High cooling capacity of 2000 kW
- Ideal for AI, HPC & high-density data centers
- Remote monitoring capabilities via multiple protocols
- Hot-swappable components for easy maintenance
- Robust leak detection system
- User-friendly 10-inch touchscreen display
Stock: In Stock
Stock: In Stock
- Designed for AI and HPC applications
- High cooling capacity of 1500 kW
- Supports remote monitoring via multiple protocols
- Robust construction weighing approximately 840 kg
- Hot-swappable components for easy maintenance
- Operates efficiently in high humidity environments
Stock: In Stock
Stock: In Stock
- Designed for AI and HPC applications
- Efficient liquid-to-liquid cooling method
- Supports high-density data centers
- Integrated leak detection for safety
- Remote monitoring capabilities
- Touchscreen display for easy operation
Stock: In Stock
Stock: In Stock
- High cooling capacity of 240 kW
- Ideal for AI and HPC applications
- Supports remote monitoring via multiple protocols
- Integrated leak detection for safety
- Hot-swappable components for easy maintenance
- Efficient liquid-to-air cooling method
Stock: In Stock
Stock: In Stock
- High cooling capacity of 180 kW
- Ideal for AI, HPC, and high-density data centers
- Supports remote monitoring via multiple protocols
- Integrated leak detection for safety
- Hot-swappable components for easy maintenance
- Operates efficiently in a wide temperature range
Stock: In Stock
Stock: In Stock
- High cooling capacity of 80 kW for demanding applications
- Ideal for HPC, AI, and enterprise data centers
- Features direct liquid cooling technology for efficient heat management
- Remote monitoring capabilities via webserver and Modbus
- Compact 4U rack-mount design for easy integration
- Includes internal and external leak detection for safety
Stock: In Stock
Stock: In Stock
- High airflow of 258 CFM for effective cooling
- Operates at a rated speed of 7400 RPM
- Durable aluminum frame and plastic impeller
- Wide operating temperature range of -10 to +60°C
- Pulse sensor for enhanced performance monitoring
- Lightweight design at 390 g for easy installation
Stock: In Stock
Stock: In Stock
- High airflow of 310 CFM for efficient cooling
- Rated speed of 7600 RPM for optimal performance
- Durable aluminum construction ensures longevity
- Wide operating temperature range of -20 to +70°C
- IP20 rating for protection against solid objects
- Pulse sensor for precise speed control
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Designed for NVIDIA H100 GPUs
- Efficient liquid-to-chip heat transfer
- Microchannel fin design for optimal cooling
- Lightweight at 1,078 g
- Supports maximum heat load of 8 kW
Stock: In Stock
Stock: In Stock
- Designed for NVIDIA H100, H200 & A100 GPUs
- Efficient direct-to-chip liquid cooling technology
- High thermal conductivity of 205 W/m·K
- Compact dimensions for easy installation
- Robust aluminum construction for durability
- Supports maximum heat load of 5.5 kW
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Efficient liquid-to-chip heat transfer
- Designed for maximum heat load of 700 W
- Compact dimensions of 180 × 100 × 15 mm
- Microchannel fin design for enhanced cooling
- Durable copper construction for longevity
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Direct-to-chip cooling technology for efficient heat transfer
- Compact dimensions of 300 × 120 × 18 mm
- Microchannel fin design for optimal cooling performance
- Lightweight at only 1,200 g
- Compatible with various GPU setups
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Efficient liquid-to-chip heat transfer
- Compact dimensions of 180 × 100 × 15 mm
- Designed for maximum heat load of 1,000 W
- Microchannel fin type for enhanced cooling performance
- Durable copper construction for longevity
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