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-250x250.png "CoolIT CHx2000 2MW Liquid-to-Liquid Coolant Distribution Unit")
Stock: In Stock
Stock: In Stock
- High cooling capacity of 2000 kW
- Ideal for AI, HPC & high-density data centers
- Remote monitoring capabilities via multiple protocols
- Hot-swappable components for easy maintenance
- Robust leak detection system
- User-friendly 10-inch touchscreen display
Stock: In Stock
Stock: In Stock
- Designed for AI and HPC applications
- High cooling capacity of 1500 kW
- Supports remote monitoring via multiple protocols
- Robust construction weighing approximately 840 kg
- Hot-swappable components for easy maintenance
- Operates efficiently in high humidity environments
Stock: In Stock
Stock: In Stock
- Designed for AI and HPC applications
- Efficient liquid-to-liquid cooling method
- Supports high-density data centers
- Integrated leak detection for safety
- Remote monitoring capabilities
- Touchscreen display for easy operation
Stock: In Stock
Stock: In Stock
- High cooling capacity of 240 kW
- Ideal for AI and HPC applications
- Supports remote monitoring via multiple protocols
- Integrated leak detection for safety
- Hot-swappable components for easy maintenance
- Efficient liquid-to-air cooling method
Stock: In Stock
Stock: In Stock
- High cooling capacity of 180 kW
- Ideal for AI, HPC, and high-density data centers
- Supports remote monitoring via multiple protocols
- Integrated leak detection for safety
- Hot-swappable components for easy maintenance
- Operates efficiently in a wide temperature range
Stock: In Stock
Stock: In Stock
- High cooling capacity of 80 kW for demanding applications
- Ideal for HPC, AI, and enterprise data centers
- Features direct liquid cooling technology for efficient heat management
- Remote monitoring capabilities via webserver and Modbus
- Compact 4U rack-mount design for easy integration
- Includes internal and external leak detection for safety
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Designed for NVIDIA H100 GPUs
- Efficient liquid-to-chip heat transfer
- Microchannel fin design for optimal cooling
- Lightweight at 1,078 g
- Supports maximum heat load of 8 kW
Stock: In Stock
Stock: In Stock
- Designed for NVIDIA H100, H200 & A100 GPUs
- Efficient direct-to-chip liquid cooling technology
- High thermal conductivity of 205 W/m·K
- Compact dimensions for easy installation
- Robust aluminum construction for durability
- Supports maximum heat load of 5.5 kW
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Efficient liquid-to-chip heat transfer
- Designed for maximum heat load of 700 W
- Compact dimensions of 180 × 100 × 15 mm
- Microchannel fin design for enhanced cooling
- Durable copper construction for longevity
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Direct-to-chip cooling technology for efficient heat transfer
- Compact dimensions of 300 × 120 × 18 mm
- Microchannel fin design for optimal cooling performance
- Lightweight at only 1,200 g
- Compatible with various GPU setups
Stock: In Stock
Stock: In Stock
- High thermal conductivity of 385 W/m·K
- Efficient liquid-to-chip heat transfer
- Compact dimensions of 180 × 100 × 15 mm
- Designed for maximum heat load of 1,000 W
- Microchannel fin type for enhanced cooling performance
- Durable copper construction for longevity
Stock: In Stock
Stock: In Stock
- Efficient liquid cooling for high-performance CPUs
- Stylish ARGB lighting for aesthetic builds
- Compatible with Intel and AMD sockets
- Quiet operation with hydro bearing fans
- Easy installation with CPU socket mount
- Durable copper cold plate for optimal heat dissipation
Stock: In Stock
Stock: In Stock
- Optimized radiator airflow for efficient cooling
- ARGB lighting for aesthetic appeal
- Low-noise operation for a quieter PC experience
- Compatible with multiple Intel and AMD sockets
- Hydraulic bearing for enhanced durability
- Easy installation with CPU socket mount
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